Lub tshuab cua txias micro thermoelectric (Micro TEC), tseem hu ua micro thermoelectric cooling module, Micro-peltier module, Micro peltier element, tau txais kev pom zoo dav dav thoob plaws ntau lub tshuab thev naus laus zis siab vim nws cov khoom siv lub cev sib txawv thiab kev sib raug zoo ntawm engineering.

Lub tshuab cua txias micro thermoelectric (Micro TEC), tseem hu ua micro thermoelectric cooling module, Micro-peltier module, Micro peltier element, tau txais kev pom zoo dav dav thoob plaws ntau lub tshuab thev naus laus zis siab vim nws cov khoom siv lub cev sib txawv thiab kev sib raug zoo ntawm engineering. Nws cov ntawv thov tseem ceeb yog tsom mus rau thaj chaw uas xav tau cov qauv kev ua tau zoo - suav nrog kev ruaj khov ntawm qhov kub thiab txias, kev teb sai ntawm thermal, qhov chaw me me, thiab kev sib raug zoo ntawm electromagnetic - suav nrog kev sib txuas lus optical, cov khoom siv hluav taws xob rau cov neeg siv khoom, cov cuab yeej siv kho mob, cov khoom siv hluav taws xob hauv tsheb, cov tshuab aerospace thiab kev tiv thaiv, thiab cov khoom siv precision industrial.

I. Kev Sib Txuas Lus Optical (Kev Siv Tswv Yim Tseem Ceeb)

Micro TECs, Micro thermoelectric modules, Micro peltier cov khoom siv ua cov khoom tswj kub tseem ceeb rau lasers hauv cov khoom siv optical transceivers ceev ceev (piv txwv li, 10G, 25G, 100G, 400G, thiab 800G modules). Los ntawm kev tswj qhov kub ntawm laser junction hauv ± 0.1 ° C, lawv ua kom tsis txhob muaj qhov wavelength drift thiab inter-channel crosstalk, yog li ua kom muaj kev ncaj ncees ntawm lub teeb liab thiab kev ntseeg tau hauv kev xa cov ntaub ntawv bandwidth siab. Qhov kev thov nce ntxiv rau kev sib txuas optical qis-latency, high-throughput - tsav los ntawm AI-intensive computing infrastructure hauv cov chaw khaws ntaub ntawv thiab AI kev cob qhia clusters - tau ua kom Micro TEC kev lag luam (micro peltier module) kev loj hlob sai heev. Thaum cov kev daws teeb meem siab tseem yog cov thawj coj thoob ntiaj teb xws li Ferrotec thiab KELK, cov chaw tsim khoom hauv tsev tab tom ua kom muaj kev vam meej hauv kev txhim kho cov khoom siv thermoelectric, cov thev naus laus zis ntim khoom hermetic, thiab cov peev xwm sib koom ua ke ntawm lub kaw lus, pab txhawb kev hloov pauv maj mam tab sis ruaj khov ntawm cov saw hlau.

II. Cov Khoom Siv Hluav Taws Xob Rau Cov Neeg Siv Khoom

Micro TECs, Micro thermoelectric txias modules (miniature peltier module) tau siv ntau dua hauv kev tswj hwm thermal rau cov khoom siv portable thiab compact - suav nrog smartphone auxiliary cooling clamps, desktop thermoelectric dej dispensers (kub / txias), micro-scale PCR instruments, thiab USB-powered mini-refrigerators. Lawv cov solid-state architecture - cim los ntawm xoom qhov chaw txav mus los, kev co tsis tseem ceeb, ultra-low acoustic suab nrov, thiab sub-millimeter daim ntawv yam - sib phim nrog cov qauv tsim tseem ceeb hauv cov khoom siv hluav taws xob: miniaturization, ntsiag to ua haujlwm, thiab seamless kev koom ua ke.

III. Cov cuab yeej siv kho mob

Kev kuaj mob hauv vitro (IVD) thiab cov platform kev tshawb fawb txog lub neej vam khom Micro thermoeletric modules, Micro peltier elements, Micro TECs, miniature peltier elements rau kev tswj hwm thermal kom meej thiab dynamic:

(1) Hauv cov txheej txheem polymerase chain reaction (qPCR) tiag tiag, Micro TECs, Micro thermoelectric modules (Micro TEC modules) ua rau muaj kev hloov pauv thermal millisecond (tus nqi cua sov ≥ 3 ° C / s; tus nqi txias ≥ 2 ° C / s), xyuas kom meej qhov tshwj xeeb ntawm kev ua kom loj hlob thiab kev ua dua tshiab;

(2) Cov thawv thauj khoom txias uas nqa tau rau cov tshuaj thiab cov tshuaj tiv thaiv kab mob tswj tau qhov kub thiab txias ruaj khov ntawm 2–8°C, ua tau raws li WHO cov kev cai ua ntej rau kev thauj khoom uas tswj tau qhov kub thiab txias;

(3) Hauv cov tshuaj ntsuas ntshav thiab tshuaj lom neeg hauv tsev kho mob, kev txias hauv zos ntawm CCD/CMOS duab sensors (kev ua haujlwm ntau yam: -10°C txog +5°C) txo qhov suab nrov tsaus ntuj thiab txhim kho qhov sib piv ntawm lub teeb liab thiab suab nrov;

(4) Hauv cov khoom siv kho mob zoo nkauj—xws li cov tshuab tshem tawm cov plaub hau laser semiconductor thiab cov platforms teeb pom kev zoo (IPL)—Micro peltier coolers, Micro TECs, micro thermoelectric cooling modules, muab kev txias epidermal los txhim kho kev nyab xeeb kev kho mob, kev ua haujlwm zoo, thiab kev nplij siab ntawm tus neeg mob.

IV. Cov Khoom Siv Hluav Taws Xob Hauv Tsheb

Nrog rau kev nthuav dav ntawm cov tsheb sib txuas ntse thiab cov tshuab pabcuam tsav tsheb siab heev (ADAS), Micro TEC modules, Micro TECs, Miniature thermoelectric modules raug siv rau kev them nyiaj thermal hauv LiDAR transmitter/receiver units, ua kom muaj kev ua haujlwm optical zoo ib yam thoob plaws qhov chaw huab cua hnyav (−40 ° C txog + 85 ° C). Lawv kuj tau koom ua ke rau hauv cov kab ke tswj huab cua hauv chav tsev, xws li cov tub yees ntse uas tau teeb tsa hauv tsheb. Muaj 12 V DC input, kev siv hluav taws xob tsawg (< 5 W typical), kev ua haujlwm siab (kev co thiab kev poob siab tiv taus), thiab ultra-compact footprint (< 10 mm²), Micro thermoelectric modules, Micro peltier modules, Micro thermoelectric cooling modules (micro thermoelectric modules) ua tau raws li kev ntseeg siab ntawm tsheb thiab qhov chaw tsim qauv.

V. Kev Ua Haujlwm Huab Cua thiab Kev Tiv Thaiv

Micro TECs, Micro peltier cov khoom siv tau ua pov thawj tias ua tau zoo hauv kev ua haujlwm hauv lub voj voog hauv cov txheej txheem tswj cua sov ntawm lub satellite. Piv txwv li, cov chav tsim khoom hauv tebchaws tau raug lees paub ntawm lub tsheb tua hluav taws "Lianjian-1", ua kom muaj kev tswj hwm cua sov ntawm cov khoom siv hluav taws xob tseem ceeb - suav nrog cov khoom siv sib txuas lus optical onboard thiab cov khoom siv infrared focal plane arrays siab - hauv qhov chaw nyuaj. Tsis tas li ntawd, lawv txhawb nqa cov khoom siv infrared detectors thiab cov txheej txheem CCD duab hauv huab cua, qhov twg qhov kev ruaj khov thermal zoo tshaj plaws yog qhov tseem ceeb rau kev daws teeb meem siab thiab kev txheeb xyuas lub hom phiaj meej.

VI. Cov Cuab Yeej Siv Rau Kev Lag Luam

Cov ntawv thov tseem ceeb suav nrog:

(1) Kev ruaj khov ntawm qhov kub thiab txias ntawm cov twj tso kua mis fiber ntau thiab ultrafast laser (kev ruaj khov ≤ ± 0.05 ° C), kom ntseeg tau tias cov zis hluav taws xob sib xws thiab qhov zoo ntawm lub teeb;

(2) Kev txias tob ntawm mercury cadmium telluride (MCT) lossis HgCdTe infrared detectors hauv thermal imagers thiab spectroscopic analyzers (mus txog -40 ° C), ua rau muaj suab nrov thermal thiab txhim kho kev rhiab heev ntawm kev kuaj pom;

(3) Kev ua haujlwm cryogenic ntawm cov koob yees duab CMOS siv rau kev soj ntsuam hnub qub thiab kev tshuaj xyuas qhov tsis zoo ntawm semiconductor wafer, qhov twg qhov tsaus ntuj txo qis ua rau lub sijhawm raug teeb tsa ntev dua thiab cov duab zoo dua;

(4) Cov modules tiv thaiv kev sib sau ua ke rau cov txee tswj hluav taws xob hauv cov chaw muaj av noo siab, siv cov cua txias hauv zos los tswj cov dej noo thiab xyuas kom meej tias kev ua haujlwm ntev.

Qhov tshwj xeeb thiab tsis muaj qhov hloov pauv ntawm Micro TEC, micro thermoelectric module yog los ntawm cov nyhuv Peltier solid-state, uas muab cov txiaj ntsig synergistic:

• Kev tswj cua sov dynamic uas muaj qhov tseeb siab: lub sijhawm teb cua sov millisecond; qhov tseeb ntawm kev tswj qhov kub thiab txias zoo dua ±0.1°C;

• Ua haujlwm ntsiag to, tsis muaj kev co: tsis muaj cov khoom siv kho tshuab tig lossis rov qab - zoo tagnrho rau kev siv optical alignment-sensitive, sensing, thiab imaging;

• Kev ua kom me me thiab muaj peev xwm muab tso rau hauv: sib xws nrog cov ntim khoom chip-on-board (COB) thiab kev sib xyaw ua ke hauv cov tsev ntawm lub cuab yeej, ua rau muaj kev tswj hwm kub hauv qab millimeter;

• Kev ruaj khov ntawm ib puag ncig: kev ua haujlwm tsis muaj cov tub yees txias; xoom cov pa phem ntawm cov tshuaj ozone lossis cov pa roj av uas ua rau lub ntiaj teb sov; ua raws li cov qauv kev cai lij choj RoHS thiab REACH.

Cov Lus Qhia Tshwj Xeeb ntawm TES2-2402T200

Qhov kub ntawm sab kub yog 27 C,

Imax: 1.4A,

Umax: 1.98V

Qmax:> 0.7 W

ACR: 1.35 ± 0.1 Ω

Delta T siab tshaj plaws: 99 C

Loj: Qhov loj me: 6.6 × 6.6 hli, qhov loj sab saud 4X4 hli,

Qhov siab: 4.9 ± 0.1 hli.

Hlau: 28 AWG hlau hlau ntev: 45.7 hli