Vim yog qhov kev nthuav dav sai ntawm AI computing fais fab xav tau, qhov kev thov rau micro-thermoelectric coolers (Micro-TECs) tau nce siab heev hauv xyoo 2026. Raws li AI-tsav cov chaw khaws ntaub ntawv vam khom rau cov kev sib txuas lus optical siab, kaum tawm txhiab tus optical modules ib qho chaw tam sim no xa cov ntaub ntawv ntau heev ntawm qhov ceev ze li lub teeb. Qhov kev loj hlob no yog lub hauv paus tseem ceeb hauv kev nce qib ntawm kev tswj hwm thermal uas cuam tshuam nrog kev nce qib ntawm kev suav ceev - tshwj xeeb tshaj yog hauv AI infrastructure - qhov twg kev tswj hwm qhov kub thiab txias tau dhau los ua qhov tseem ceeb rau kev ntseeg tau ntawm lub kaw lus, kev ncaj ncees ntawm lub teeb liab, thiab lub neej ntev ntawm cov khoom siv. Cov teeb meem no tshwm sim thoob plaws plaub qhov chaw thov tseem ceeb:
1. Kev xa mus ntev ntawm cov pob txha caj qaum: Cov modules optical Dense wavelength division multiplexing (DWDM)—muaj peev xwm xa mus deb tshaj 80 km—yuav tsum tau Micro-TECs (micro thermoelectric modules, Micro peltier modules) kom tswj tau qhov kub thiab txias ntawm laser diode kom ruaj khov hauv qhov kev kam rau siab, yog li tiv thaiv kev hloov pauv ntawm wavelength thiab ua kom muaj kev sib cais ntawm cov channel spectral hauv cov tes hauj lwm tseem ceeb.
2. Cov chaw khaws ntaub ntawv ua tau zoo: Hauv cov chaw cob qhia AI thiab cov chaw suav huab, cov khoom siv photonic integrated circuits (PICs) uas muaj kev sib koom ua ke siab tsim cov cua sov hauv zos. Micro-TECs, Micro thermoelectric cooling module, Micro peltier elements muab cov thermoregulation dynamic, real-time los tswj cov kub ua haujlwm zoo tshaj plaws rau kev suav thiab kev sib txuas ntawm cov subsystems.
3. Kev tsim kho vaj tse 5G/6G: Cov chaw nres tsheb sab nraum zoov ua haujlwm nyob rau hauv qhov kub thiab txias heev (piv txwv li, -40 ° C txog +85 ° C). Micro-TECs, Micro peltier liner, micro-peltier coolers ua rau muaj kev tswj hwm thermal bidirectional - txias thaum lub sijhawm kub siab tshaj plaws thiab cua sov thaum lub sijhawm sub-zero - ua kom ntseeg tau tias muaj kev ua haujlwm ntawm optical module tsis muaj kev cuam tshuam thoob plaws txhua qhov chaw ua haujlwm.
4. Cov kab ke sib txuas lus optical sib xws: Hauv cov network metropolitan, wide-cheeb tsam, thiab submarine fiber-optic, cov coherent transceivers tsim cov kev cai ruaj khov ntawm theem thiab polarization ntawm cov teeb liab optical. Micro-TECs, Micro-peltier modules, micro thermoelectric coolers xa cov kev ruaj khov kub sub-millikelvin-level—qhov tseem ceeb rau kev tswj hwm kev sib raug zoo ntawm kev tshawb pom thiab txo qis qhov yuam kev me ntsis (BER).
5. Kev sib txuas lus hauv kev lag luam thiab lub hom phiaj tseem ceeb: Hauv cov chaw ib puag ncig hnyav—xws li kev lag luam automation, kev saib xyuas systems, thiab aerospace applications—Micro-TECs, micro peltier elements ua kom muaj kev ua haujlwm zoo ntawm optical module hla ntau qhov kub thiab txias (−40 °C txog +105 °C), txhawb kev ntseeg siab rau kev ua haujlwm mus sij hawm ntev.
I. Kev tswj cua sov kom raug yog qhov tseem ceeb rau kev loj hlob
Cov modules optical ceev ceev—tshwj xeeb tshaj yog cov uas ua haujlwm ntawm 800G, 1.6T, thiab cov nqi ntaub ntawv tshiab 3.2T—yog cov uas rhiab heev rau cov thermal perturbations. Cov laser diodes qhia txog kev vam khom qhov kub thiab txias, ua rau muaj kev puas tsuaj ntawm cov kev ua haujlwm cascading:
• Wavelength drift: Piv txwv li, cov lasers uas faib tawm (DFB) qhia txog qhov sib txawv ntawm qhov ntev thiab qhov kub ntawm ~ 0.1 nm / ° C. Tshaj li qhov kev ua haujlwm lag luam (0–70 ° C), qhov no txhais tau tias txog li 7 nm ntawm kev hloov pauv spectral - dhau qhov sib nrug ntawm cov channel hauv ntau lub DWDM systems thiab ua rau muaj kev sib tham ntawm cov channel thiab BER nce.
• Kev tsis ruaj khov ntawm lub zog kho qhov muag: Kev hloov pauv ntawm qhov kub thiab txias ncaj qha hloov kho qhov tam sim no ntawm lub laser thiab qhov ua tau zoo ntawm qhov nqes hav, ua rau muaj kev hloov pauv ntawm lub zog tso zis thiab qhov sib piv ntawm lub teeb liab thiab lub suab nrov (SNR) poob qis.
• Ua kom cov khoom siv qub sai dua: Kev ua haujlwm ntev dua sab nraum lub hnab cua sov zoo tshaj plaws ua rau cov txheej txheem puas tsuaj sai dua—xws li kev ua kom lub ntsej muag puas tsuaj thiab kev loj hlob ntawm qhov tsis zoo ntawm quantum well—txo lub sijhawm nruab nrab kom ua tsis tiav (MTTF).
Muab cov kev txwv no, cov khoom siv kho qhov muag AI-optimized tiam tom ntej yuam kom muaj qhov tseeb ntawm qhov kub thiab txias ntawm ± 0.05 °C lossis zoo dua - cov kev cai uas tsuas yog Micro-TECs, micro peltier devices, micro TEC modules, micro thermoelectric modules tuaj yeem ua tiav hauv cov yam ntxwv compact (<3 mm² footprint) thiab sub-100 ms teb lub sijhawm. Yog li ntawd, yuav luag txhua qhov nruab nrab-thiab high-end 800G + modules koom ua ke kaw-loop thermal management systems suav nrog Micro-TECs, Micro-TEC modules, micro peltier devices, micro TE modules precision thermistors, thiab dedicated temperature control ICs - zoo "locking" laser junction kub rau hauv ± 0.02 °C ntawm qhov chaw teeb tsa.
Cov txiaj ntsig zoo ntawm Micro-TECs, micro thermoelectric txias modules, micro thermoelectric elements hauv optical modules muaj peb qhov sib txuas ua ke:
• Kev ruaj khov ntawm spectral: Kev tiv thaiv kev hloov pauv ntawm wavelength ua kom ntseeg tau tias cov channel orthogonality, tshem tawm crosstalk, thiab tswj BER qis nyob rau hauv cov khoom siv thermal dynamic;
• Kev ua kom lub teeb liab zoo dua: Kev txias/cua sov hloov kho tau them rau qhov kub thiab txias uas tshwm sim los ntawm ib puag ncig thiab qhov hnyav, ua kom lub zog kho qhov muag ruaj khov thiab txhim kho qhov tob ntawm kev hloov pauv thiab qhov sib piv ntawm kev ploj mus;
• Kev siv tau ntev mus tas li: Kev rho tawm cua sov zoo txo qhov kev ntxhov siab ntawm cua sov, ncua kev puas tsuaj ntawm cov khoom thiab txo cov feem pua ntawm kev ua tsis tiav hauv thaj chaw txog li 40% (raws li cov ntaub ntawv sim lub neej ceev).
II. Kev nthuav dav ntawm Micro-TEC, micro peltier modules xa mus rau ib lub AI server
Cov neeg rau zaub mov kev cob qhia AI niaj hnub no feem ntau sib xyaw ua ke 16–32 lub modules optical ceev ceev—txhua lub xav tau 2–3 Micro-TECs, micro thermoelectric modules (micro thermoelectric cooling modules) nyob ntawm tus nqi ntawm cov ntaub ntawv, cov qauv ntim khoom (piv txwv li, co-packaged optics, CPO), thiab thermal design margin. Yog li ntawd, ib lub server AI siab kawg tuaj yeem suav nrog 40–90 Micro-TECs (Micro-peltier elements)—uas sawv cev rau qhov nce 5–10 × dua li cov servers lag luam ib txwm muaj. Nrog rau kev xa khoom thoob ntiaj teb 800G / 1.6T optical module kwv yees tias yuav tshaj 15 lab units txhua xyoo los ntawm 2026, kev thov Micro-TEC tag nrho rau petabyte-scale AI clusters yuav tsum ncav cuag kaum lab units ib xyoos.
III. Kev tshwm sim ntawm cov qauv hybrid kua txias + Micro-TEC (micro thermoelectric txias modules)
Raws li cov cuab yeej AI accelerators tiam tom ntej - suav nrog NVIDIA's GB300 platform - thawb GPU lub zog envelopes dhau 1,000 W ib lub tuag, cov kev daws teeb meem cua txias tau mus txog qhov txwv thermodynamic tseem ceeb hauv kev siv rack siab. Yog li ntawd, kev txias kua tau dhau los ua tus qauv de facto rau rack- thiab chassis-level thermal management. Hauv qhov paradigm no, ib qho kev tswj hwm txias hierarchical tau tshwm sim: kev txias kua kov cov cua sov tshem tawm ntawm theem system, thaum Micro-TECs (micro peltier coolers) ua cov txheej txheem thermal zoo, chip-level - ua kom muaj kev sib xws thermal tsis tau muaj dua thoob plaws photonic thiab electronic dies. Qhov synergistic architecture no tso Micro-TECs, micro-thermoelectric modules ua tus pab tseem ceeb - tsis yog tsuas yog ib qho khoom siv pabcuam - hauv AI compute thermal stacks.
IV. Kev hloov pauv hauv tsev sai dua thaum muaj kev txwv ntawm kev muab khoom thoob ntiaj teb
Keeb kwm, >80% ntawm cov khoom siv Micro-TECs uas muaj qhov tseeb siab, Micro thermoelectric devices (Micro TEC modules) tau muab los ntawm cov chaw tsim khoom Nyij Pooj. Txawm li cas los xij, kev thov AI uas nce siab tau ua rau lub sijhawm ua khoom siv ntev rau cov neeg muag khoom tam sim no - qee qhov tshaj 26 lub lis piam - thiab kev faib peev xwm txwv rau cov neeg siv khoom tseem ceeb. Cov chaw tsim khoom TEC modules hauv Suav teb tab tom siv qhov no: ua kom AEC-Q200 thiab Telcordia GR-468 kev tsim nyog nrog Tier-1 optical module sellers, scaling txhua hli muaj peev xwm tsim khoom mus rau ntau lab-unit theem, thiab ua tiav kev ua tau zoo parity (± 0.03 ° C stability, >1.2 W / mm² txias density) nrog cov neeg ua haujlwm thoob ntiaj teb.
Hauv kev xaus lus, qhov kev sib koom ua ke ntawm AI compute density breakthroughs, bandwidth escalation, thiab photonics integration imperatives tau tsa Micro-TECs (Micro peltier modules) los ntawm peripheral thermal components mus rau foundational infrastructure elements. Tam sim no lawv ua haujlwm ua "qhov tsim nyog tsis pom" - ib qho ntsiag to tab sis tseem ceeb txiav txim siab ntawm AI data center uptime, computational throughput, thiab ntev mus sij hawm tus nqi tag nrho ntawm kev muaj.
Beiing Huimao Cooling Equipment Co., Ltd. nrog ntau tshaj peb xyoo caum ntawm kev txawj ntse hauv kev tsim thiab tsim cov micro-thermoelectric txias modules, Micro-TECS, peb lub tuam txhab tau ua tiav tsim ntau yam khoom siv me me thermoelectric txias daws teeb meem raws li cov neeg siv khoom thoob ntiaj teb cov lus qhia. Cov khoom no tau siv dav hauv aerospace, kev kho mob, kev sib txuas lus optical, thiab kev siv precision industrial. Peb txais tos kev koom tes zoo nrog cov neeg koom tes thoob ntiaj teb rau kev sib koom tes thiab kev tsim kho ua ke ntawm cov thev naus laus zis thermoelectric txias tiam tom ntej.
Cov Lus Qhia Tshwj Xeeb ntawm TES1-00401T200
Kub sab kub: 50 C,
Imax: 0.8A,
Vmax: 0.48V
Qmax: 0.3W
Delta T siab tshaj: 76 C
ACR: 0.5 Ohm
Loj: 2.3 × 1.1 × 0.95 hli
Lub sijhawm tshaj tawm: Lub Yim Hli-11-2026
